Job Description

• Experience in advanced package techniques, including 3D integration, MCM, FOWLP, Hybrid bonding etc
• Troubleshoot new and existing packaging problems involving design, materials and processes and provide creative, timely, and cost-effective solutions
• Define and drive package qualifications, including MSL, BHAST, HTS, TC, PTC, board level reliability and conduct FMEA
• Troubleshoot package qualification and manufacturing issues, drive root cause failure analysis, and lead issues to resolution
• Manage qualification of new packages or changes to ensure quality and mitigate risk
• Experienced in computational FEM techniques for thermal and mechanical analysis with understanding of thermal and stress issues and solutions
• Expert in problem-solving/troubleshooting and providing a solution
• Ability to work in a fast-paced environment

Functional Knowledge

• Demonstrates conceptual and practical expertise in own discipline and basic knowledge of related disciplines

Business Expertise

• Has knowledge of best practices and how own area integrates with others; is aware of the competition and the factors that differentiate them in the market

Leadership

• Acts as a resource for colleagues with less experience; may lead small projects with manageable risks and resource requirements

Problem Solving

• Solves complex problems; takes a new perspective on existing solutions; exercises judgment based on the analysis of multiple sources of information

Impact

• Impacts a range of customer, operational, project or service activities within own team and other related teams; works within broad guidelines and policies

Interpersonal Skills

• Explains difficult or sensitive information; works to build consensus

Education: Bachelor's Degree

Experience: 10- 15 Years

Qualifications

Education:

Bachelor's Degree

Years of Experience: 10 - 15 Years

Work Experience:

Additional Information

Travel: Relocation Eligible:

No