Job description 

This job is for a 3DIC thermal design engineer; In this role, the engineer will be a part of a team that designs cutting edge packaging solutions for industry’s leading 3DIC customers in the datacenter, AI/ML space. The candidate will evaluate the design tradeoffs by running thermal simulations to ensure the design is ready for sign-off. Experience in thermal analysis and modeling of thermal conduction, convection and radiation and how to setup simulation environment with proper boundary conditions is required.

An in-depth understanding of thermal analysis fundamentals is required to successfully architect plans for modeling of multiple side-by-side and stacked devices on the silicon interposers with chiplets and optical components. Need to work cross functionally with Synopsys’ IP teams to translate the industry’s largest IP portfolio of memory and SerDes IP’s thermal specifications into design requirements. The ideal candidate should be self-motivated, detail-oriented, and have strong coordination and partnership skills.

Qualifications

• Minimum Qualifications:

The minimum qualifications for this position include an MS/Ph.D. degree in Mechanical, Material Science or Electrical Engineering.
With 5+ years of experience Thermal Engineering field
Experience using Ansys ICEPAK, Redhawks SCET is a must. 
Knowledge of material thermal properties and how to select Thermal Interface Material (TIM), epoxies, underfills etc…
 

• Preferred qualifications:

The ideal candidate should have evidence of strong organizational and planning skills for engineering projects and possess good communication and presentation skills for executive project coordination.
Experience using Ansys Mechanical and Sherlock is a plus.
Proficient in Solidworks, Autodesk or similar cad tools.
System-level thermal simulation of enclosures, airflow and fluid dynamics
Knowledge of setting up and running transient/dynamic thermal simulations is a plus.
The candidate should also have experience working with multiple function teams for EDA tool collaboration.
Experience designing heatsinks, heat pipes, heat chambers, fans and other thermal solutions is a plus.
Experience designing thermal management of optoelectronics is a plus.