What You Will Be Doing:

• Responsible for architecting, developing, characterization of next generation power and thermal management features and solutions working with multi-functional teams across the company.
• Drive methodologies for deployment of features into products.
• Drive initiatives for power and thermal optimizations spanning across silicon, platform, software, manufacturing, and product systems; for products ranging from largescale datacenters to low-power client devices.
• Debug and architect solutions for issues seen by customers in the field across a wide range of industries.
• Influence next generation SW, chip, board, and platform design of products across SOC, GPU and CPUs in Laptops, Servers, and Datacenters
• Work alongside system architects, designers, chip and board designers, software/firmware engineers, HW/SW applications engineering, process/reliability authorities, ATE engineers, and silicon operations, in a fast-paced, high-energy, collaborative work environment to bring industry-defining products to market.

What We Need to See:

• B. Tech or M. Tech in Electronics Engineering, Computer Science, or related field (or equivalent experience)
• 5+ years of experience in silicon bring-up, validation, and productization.
• Experience with power and thermal controllers and management.
• Expertise and deep understanding in the areas of silicon power, transistor/device physics, power modeling and measurement, active power management is a plus
• Proficiency in Python, Perl or C programming languages.
• Self-starter with strong skills in multi-tasking, influencing, communication, presentation, and consensus-building
• Enthusiastic, responsive, and keen on process improvement