Dry Etch Process Development Engineer
Micron Technology
Boise, Idaho, United States
Developing dry etch processes to meet the physical and electrical requirements of Micron’s products. Optimizing dry etch processes to reduce cost, process variability, and improve process capability. Collaborating with process integration and other process development teams to develop innovative new solutions. Conducting root cause and failure mode analysis to understand the limitations of current hardware and driving vendors for solutions. Performing fundamental research to drive innovative solutions for next-generation products. Maintaining a technology development pilot manufacturing line. Support process transfer to production facilities (some domestic and/or international travel may be required). Qualifications & Skills: Experience in experimental design and data analysis. Strong analytical and creative problem-solving skills. Ability to use extensive technical knowledge to guide strategic directions. Ability to resolve complex issues through root-cause or model-based problem solving. Proficiency in statistics, preferably in statistical process control. Ability to work independently, with minimal direction, and a focus on meeting commitments. Ability to multi-task and manage numerous projects simultaneously. Experience in programming or scripting is desirable. Knowledge of semiconductor processing, solid-state device physics, and of dry etch processing or plasma physics is desirable. Education and Experience: M.S./Ph. D. (or equivalent education) in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Chemistry, Physics, or other related technical fields. B.S. degree with a minimum of 5 years' experience of relevant experience will also be considered.
