Job Responsibilities

Steer technical 3DIC enablement, deployment and customer adoption initiatives.

Work on pathfinding enabling leading edge process technology & foundry enablement activities.

Advanced 2.5D and 3D technology development - Design flows, including APR, EM/IR, Thermal, and SI/PI, enablement.

Partner with internal product teams & RnD to know about overall product requirements and align on customer needs.

Deliver technical presentations, conducting product demonstrations and benchmarks, and participating in developing solutions and deployment strategies.

Job Requirements

Minimum of Bachelor Degree in Electronic / Microelectronics with 10+ years of hands-on experience in RTL2GDS and 3DIC segments

Experience working with IC data formats (Verilog, LEF/DEF, GDS etc.)

Sound knowledge of semiconductor manufacturing process and packaging technologies.

Knowledge on 3D architectural evaluation which includes 3D floor planning, routing, interconnect, TSV insertion, and associated die size, performance, and thermal modelling

Deep Synopsys tools and flows knowledge are required, in addition to solid knowledge of scripting languages such as tcl, python, perl, unix shell

Excellent on debug, communication and presentation skills are a must as this position requires interaction at multiple levels within and outside

Self-motivated with ability to solve complex problems.