Job description 

Qualifications

Required:

• BS/MS in Electrical or Computer Engineering
• 12+ years of experience in semiconductor design.
• Great communication, collaboration and teamwork skills and ability to contribute to diverse and inclusive teams.
• Proven track record of implementing designs through synthesis, floorplanning, place and route, extraction, timing, and physical verification.

Preferred:

• Large SoC/CPU/IP design tape-out experience in the latest foundry process nodes.
• Excellent project management skills and ability to juggle multiple projects at once.
• Strong understanding of constraints generation, STA, timing optimization, and timing closure.
• In-depth understanding of design tradeoffs for power, performance, and area.
• Hands on experience with CTS and global clock distribution methods in multi-voltage, multi-clock, multi-domain, and low power designs.
• Experience in EDA tools such as Primetime, StarRC, Design Compiler, ICC, Fusion Compiler, Innovus etc.
• Experience and knowledge of formal equivalency checks, LEC, LP, UPF, reliability, SI, and Noise.
• Exposure and some hands-on experience with PD flows bring up/setup/flow flush, overall know how of PD-TFM and PD methodology will be a bonus.
• Strong problem-solving and data analysis skills
• Automation skills using scripting languages such as Perl, TCL, or Python.
• Technically leading/guding a eam of multiple PD engineers in order to deliver a Sub-Chip/SoC will be a big plus.

Responsibilities

In this high impact role on the team, you will be responsible to: 

• Demonstrate technical expertise in all aspects of Physical Design, from synthesis to place and route of partitions through all signoff including timing signoff, physical verification, EMIR signoff , Formal Equivalence, and Low Power Verification.
• Own complete PD execution of Sub-systems/Sub-chips instantiating multiple other Physical partitions.
• Own partition floorplanning for optimizing blocks for Power, Performance and Area.
• Have close collaboration with RTL team to help drive and resolve design issues related to block closure.
• Understand tools, flows, and overall design methodology in design construction, signoff, and optimization with a data driven approach.
• Implement robust clock distribution solutions using appropriate methods that meet design requirements.
• Make good independent technical trade-offs between power, area, and timing (PPA).
• Be able to guide and coordinate with all sub-partitions PD to be able to take the Sub-chip through PD (construction through signoff) closure.
• Additionally flow flush PD TFM on few design partitions for early identification of any design PD flow issues before every PD TFM release is proliferated and deployed across all partitions/subchips for PD execution.
• Partner closely with PD flow/CAD team and PD methodology team to flag & fix PD TFM issues upfront and ensure those are fixed in the next PD TFM release from CAD or are updated in the design project layer (as appropriate).