About Applied Materials:

Applied Materials, Inc. (Nasdaq: AMAT) is the leader in materials engineering solutions used to produce

virtually every new chip and advanced display in the world. Our expertise in modifying materials at

atomic levels and on an industrial scale enables customers to transform possibilities into reality. At

Applied Materials, our innovations make possible the technology shaping the future.

Our PDC products comprise advanced imaging hardware- Deep UV Imaging, Scanning Electron Microscopy, and cutting-edge software to detect, measure and classify nanometer size defects from semiconductor fabrication process steps.

Job Duties and Responsibilities:

• Performs e-Beam imaging simulation for layers from advanced semiconductor tech nodes
• Recommends optimal working point for our platforms based on thorough understanding of complex defect imaging and metrology requirements in chip fabrication process steps
• Proposes ideas towards strengthening our leadership position in e-Beam technology
• Responsible for improving and developing new features for simulation software utility

Qualifications and Skills

• PhD (Preferred)/ Masters in Physics/ Materials Engg / Electronics
• Sound fundamentals in Science- generating idea, designing and performing simulation & experiment, investigating results and closing the loop with actionable insights
• Hands-on experience in using semiconductor fabrication and e-Beam metrology equipment
• Detail oriented with strong analytical and problem-solving skills
• Ability to lead complex technical projects both with internal stakeholders and customer
• Open for long assignments overseas at leading semiconductor fab sites for the first two years

Qualifications

Education: Master's Degree

Years of Experience: 4 - 7 Years

Additional Information

Travel: Yes, 75% of the Time

Relocation Eligible:

Yes