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Interim Engineering Intern_2025_HW

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General Summary:

We know our employees’ ideas change the world. For more than three decades, we’ve been a global leader in mobile technology, continually pushing the boundaries of what’s possible. Working with customers across industries — from automotive to health care, from smart cities to robotics— we continue to accelerate innovation and unlock new possibilities in a time where everything is connected. By joining the Qualcomm family, you too can bring the future forward faster.

 

SOC & Hard Macro Physical Design
• SOC Validation & Debug
• RF & Analog Layout
• RF/Analog/Mixed Signal/Power IC Design
• Low Power Design
• Board and FPGA Design
• Digital ASIC Design
• Design/SOC Verification
• CAD Solution Engineer
• Design for Test (DFT)
• CPU Design


Must have educational background in one or more of the following areas:


• Verifying SoC with embedded RISC/DSP processors, communications/ networking ASICs.
• Verilog or VHDL, C/C++, Tcl/Perl/shell-scripting. RTL design experience and/or strong OO programming knowledge
• Knowledge of wireless/wired communications and protocols or graphics/video multi-media is a plus.
• Knowledge in PLL, LNA, OpAmp, CMOS, ADC/DAC, Cadence, SpectreRF, or Layout is required in RF/Analog/Mixed Signal IC Design.
• Excellent analytical and problem solving skills.
• Ability to collaborate and work in teams.
• Good verbal and written communication skill


Educational Background:
Masters, Bachelors: Electrical Engineering , VLSI , Embedded and VLSI , ECE

Set alert for similar jobsInterim Engineering Intern_2025_HW role in Hyderabad, India or Bengaluru, India
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Company

Qualcomm

Job Posted

2 months ago

Job Type

Full-time

WorkMode

On-site

Experience Level

0-2 Years

Category

Engineering

Locations

Hyderabad, Telangana, India

Bengaluru, Karnataka, India

Qualification

Bachelor

Applicants

78 applicants

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